RTP-200

● Rapid Thermal Annealing Process Oven with vacuum

● 7“ Touch Panel

● Programmable temperature profiles

● Record of process data

Application

The RTP-200 Rapid Thermal Annealing Vacuum oven is an ex cellent tool for various semiconductor processes up to 200 mm diameter wafer or 200x200 mm substrate size.

Some examples for applications: Laboratory furnace for all kind of developers implementing and researching new processes, prototype research, environmental research purposes and for small pre-series or series.

Process Gases

The RTP-200 can be used with standard process gases, like

Nitrogen, Oxygen, Forming Gas. The chamber is sealed and can easily be cleaned.

Gas flow Control

One gas line with Mass Flow Controller (MFC) for Nitrogen

(5 nlm = norm liter per minute) is default, three more gas lines

(Option: Mass Flow Controller) are possible.

Vacuum

The system is vacuum capable of up to 10-3 hPa. For higher

vacuum we offer the model RTP-200-HV (up to 10-6 hPA).

Heating

The maximal achievable temperature is 1000 °C. Key features are precisely controlled fast ramp-up 75 K/sec) and excellent ramp-down rates (depends on temperature and loading).

Temperature

The RTP-200 allows an excellent temperature distribution and homogeneity. Optionally a graphite susceptor can be inserted into the quartz chamber (Option: GP Graphite Plate or Susceptor)