Features

FPA-6300ESW scanners are equipped with a Wide-Field Lens

By changing the projection lens magnification (4:1 → 3.125:1), FPA-6300ESW scanners realize

a wider exposure field with the reticle size remaining at 6 inches.

The FPA-6300ESW is the only KrF scanner in the world that can expose a full size CMOS image

sensor without *stitching because 33 mm x 42.2 mm can be exposed in one shot.

*Stitching exposure: A method of increasing exposure field size by connecting two or more

adjacent exposure regions. The positional accuracy and alignment of the adjacent exposure regions directly affects the yield.

FPA-6300ESW scanners are derived from the proven FPA-6300ES6a Platform

FPA-6300ESW scanners adopt technology developed to support Front-End-Of-the-line (FEOL) semiconductor

manufacturing processes and are able to provide the similar utilization and reliability as FPA-6300ES6a scanners.

FPA-6300ESW scanners also feature an extendable platform allowing field upgrades for improving productivity and overlay accuracy.

Specifications

Resolution：≤130 nm

NA (Numerical Aperture)：0.45~0.70 (Variable)

Reduction Ratio：1:3.125

Field Size：33 mm x 42.2 mm

Exposure Wavelength：KrF 248 nm

Reticle Size：6 inch

Wafer Size：300 mm (12 inch)

Overlay Accuracy：≦9nm

Main Body Dimensions：(W) 2,300 x (D) 5,155 x (H) 2,900 mm