FPA-3030i5a Steppers deliver performance and flexibility required for manufacturing and R&D environments

and support a variety of substrates including GaAs, GaN, transparent sapphire, and SiC wafers.This system is

able to support a range of wafer sizes for innovative Internet-of-Things (IoT), 5G, automotive, power and

Micro-electromechanical Systems (MEMS) applications and can be configured to process wafers from 50 mm (2")

to 200 mm (8") in diameter.The resolution, overlay, productivity and available options make it a cost-effective

solution for challenging ≤ 200 mm wafer processes.

FPA-3030i5a FEATURES

Resolution ≤ 350 nm

Lens Reduction 5:1

Substrate handling capability: 50, 75, 100, 150, 200 mm

FPA-3030i5a Steppers leverage and extend proven Canon FPA-3000 Stepper designs

Canon Built-In Metrology (CANOMAP)